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Name:
QFN Lead Frame Front Film Laminating Machine
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Equipment Features:
Specifically designed for special thin films; features heated film laminating rollers, AOI precision detection after film laminating, and real-time monitoring of film quality.
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Film Laminating Precision:
±0.1-0.3mm;
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Supplier:
Automatic Control and Supply
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Platform Temperature:
Maximum 150 ℃;
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Frame Size:
250*78mm (Customized vacuum fixture platform required for various frames according to customer needs)
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UPH Capacity:
250-300
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Workflow:
Automatic Loading > Cleaning > Film Laminating > Precision Inspection > Automatic Unloading
QFN Lead Frame Front Film Laminating Machine
Designed for QFN/DFN front film laminating processes, completing automatic loading and unloading of frame products with dual-track design, automatic AOI precision detection, and automatic application of QFN/DFN tape on product surface; meets all requirements for stacking and magazine-style loading and unloading at the same time. Mainly used in semiconductor etching lead frame companies; can be upgraded to be compatible with integrated front and back film laminating processes;
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