Empowering the New Semiconductor Display Industry, and Facilitating the Localization of High-end Equipment!
Bonding
The Bonding Division forms the backbone of Liande Equipment Group, and has always been dedicated to the research, design, production, sales, and after-sales service of hot-press bonding equipment for touch screens. Always striving for excellence with a professional attitude, centered around "Film Attaching Technology," and driven by a spirit of continuous exploration, the division provides solutions for high-speed, high-precision and special-shaped FPC-related bonding equipment.
Application Areas
Automatic Loading, Cleaning, IC Bonding, FPC Bonding, Automatic Offset Detection, Adhesive Application, and Unloading
