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New Semiconductor Displays
Intelligent Cockpit System
Semiconductor Packaging and Testing
New Energy Equipment
Lamination
Bonding
AOI
Film Laminating
Mini-LED
Flexible Production Line
Intelligent Cockpit
Die Bonder Series
Film Laminating Machine Series
AOI Inspection Series
Cell and Core Manufacturing Engineering
Battery Cell Assembly Line
Module PACK Line
Other
Photovoltaic Equipment
VR/MR Lamination Line
Small and Medium-sized Curved/Foldable Screen Full Lamination Line
Medium and Large-sized Full Lamination Lines
Small and Medium-sized Bonding Line (COF/COG/FOG, etc.)
Large-sized/Ultra-large-sized Bonding Line (OLB/FOB, etc.)
VR/MR Bonding Line
COG/COF/FOG Press Mark + Impedance AOI Machine
LCD Screen Defect AOI Machine
OTP/CTP Program Burning
OLED Curved Film Laminating Machine
LCD/OLED Flat Film Laminating Machine
Curved Copper Foil Laminating Machine
Sorting Machine
Small and Medium-sized High-Volume Transfer Equipment
Large-Sized High-Volume Transfer Equipment
COF/PCB Bonding Line
LED Chip Expander
Vacuum Pre-pressed Film Laminating Machine
High-Precision Splicing Equipment
Wafer AOI Equipment
Mobile Phone Bare Unit Assembly Line
Battery, and Fingerprint Assembly
Mobile Phone Frame Detection Machine
Splitter Riveting Assembly Equipment
Vehicle OCA/OCR Lamination Production Line
Backlight Assembly Line
Backlight Stack Assembly Line
Vehicle Binding Assembly Line
Cockpit Assembly/C-Pillar
Wafer AOI Machine
Die Cutting Machine
Cutting and Stacking All-in-one Machine
High-Speed Stacking Machine
Square aluminum shell cell assembly line
Vacuum Drying Line
Liquid Injection Line
Blue Film Wrapping Sorting Line
Square Battery Module Pack Line
Cylindrical Cell Module Pack Line
CCS Automatic Assembly Line
Photovoltaic Equipment
Innovation Center
Research and Development Strengths
Innovative Technology
Service Innovation
News and Events
Company News
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Recruitment Strategy
Career Development
Investor Relations
Company Notices
Periodic Reports
Investor Interaction
Investor Relations
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Custom Solutions
Home
About Us
Introduction to Liande
Global Coverage
Social Responsibility
Contact Us
Product Solutions
New Semiconductor Displays
Lamination
Bonding
AOI
Film Laminating
Mini-LED
Flexible Production Line
Intelligent Cockpit System
Intelligent Cockpit
Semiconductor Packaging and Testing
Die Bonder Series
Film Laminating Machine Series
AOI Inspection Series
New Energy Equipment
Cell and Core Manufacturing Engineering
Battery Cell Assembly Line
Module PACK Line
Other
Photovoltaic Equipment
Innovation Center
Research and Development Strengths
Innovative Technology
Service Innovation
News and Events
Company News
Join Us
Recruitment Strategy
Career Development
Investor Relations
Company Notices
Periodic Reports
Investor Interaction
Investor Relations
CN
EN
Product Solution
Semiconductor Packaging and Testing
Empowering the Semiconductor Packaging and Testing Industry, and Facilitating the Localization of High-end Equipment!
New Semiconductor Displays
Intelligent Cockpit System
Semiconductor Packaging and Testing
New Energy Equipment
01
Die Bonder Series
02
Film Laminating Machine Series
03
AOI Inspection Series
Soft solder solidification machine
COF Flip Eutectic Bonding Machine
Eutectic Die Bonder
Soft solder solidification machine
Quick Guide
Contact Information
Customer Case Studies
Investor Relations
Careers
Latest Products
Square Battery Module Pack Line
Cylindrical Battery Module PACK Line
Latest News
Announcement of invitation to bid on the project of selecting and employing annual audit service institutions
2023.12.24
Meet the "basket" and chase the "ball" dream -- Side note of the United Equipment vs Continental Auto electronic basketball friendly match
2023.06.05
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