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Introduction to Liande

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Product Solutions

Semiconductor displays

Intelligent Cockpit System

Semiconductor Encapsulation&Test

New Energy

Others

Lamination

Bonding

Inspection

Film Attachment

M-LED

Flexible Production Line

Automative Display

Intelligent Cockpit Assembly

Die Bonder

Flip

Tape Attachment System

AOI Inspection

COF Technology

Electrode & Core Manufacturing

Cell Assembly Line

Module Pack Line

Photovoltaic Equipment

Other

Precision Dispensing

Small-sized

Small/Medium-sized

Medium/Large Sized

Medium/Small-Sized Bonding Line

Large/Ultra-large format Bonding Line

Small-Sized Bonding Line

VR/MR Bonding Line

COG/COF/FOG Indentation Inspection & Impedance Testing Machine

LCD Screen Defect Inspection Equipment

OTP/CTP Programming

OLED Curved-Surface Laminator

LCD/OLED Flat-Surface Attachment Machine

Curved-Surface Copper Foil Laminator

Sorter

Small and Medium Sized Mass Transfer Equipment

Large-Sized Mass Transfer Equipment

M-LED COF Bonding Line

LED Wafer Expander

Vacuum Film Pre-lamination Machine

High-Precision Splicing Equipment

Wafer Inspection

Smartphone Full-Line Assembly System

TP Assembly

Customizable Equipment

Bending Machine

Backlight Assembly Full Line

Automotive OCA/LOCA Lamination Full Line

Back Light Assembly Full Line

Automative Backlight Assembly Full Line

Automative Bonding Full Line

Cockpit Assembly/C axis

COF Flip Eutectic Bonding Machine

Eutectic Die Bonder

Soft Solder Die Bonder

COF Flip Chip Eutectic Bonder

QFN Lead Frame Pre-Tape Attachment Equipment

QFN Leadframe Post-Tape Attachment Equipment

QFN Leadframe Tape Attachment All-in-One Machine

Leadframe/Substrate AOI Auto-Inspection Equipment

Wafer Inspection

COF Thermal Patch Applicator

Die Cutting Machine

Cutting & Stacking Integrated Machine

High-Speed Stacking Machine

Prismatic Aluminum Shell Cell Assembly Line

Vacuum Drying Line

Filling Line

Blue Film Wrapping & Grading Line

Prismatic Li-Ion Cell Module Pack Line

Cylindrical Cell Module Pack Line

Photovoltaic Equipment

CCS Automatic Assembly Line

Precision Dispensing
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Custom Solutions

Product Solution Semiconductor Encapsulation&Test

Empowering the Semiconductor Packaging and Testing Industry, and Facilitating the Localization of High-end Equipment!

Semiconductor displays

Intelligent Cockpit System

Semiconductor Encapsulation&Test

Tape Attachment System

QFN Leadframe Tape Attachment All-in-One Machine

QFN Lead Frame Pre-Tape Attachment Equipment QFN Leadframe Post-Tape Attachment Equipment QFN Leadframe Tape Attachment All-in-One Machine

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Announcement of invitation to bid on the project of selecting and employing annual audit service institutions

Announcement of invitation to bid on the project of selecting and employing annual audit service institutions

Meet the "basket" and chase the "ball" dream -- Side note of the United Equipment vs Continental Auto electronic basketball friendly match

Meet the "basket" and chase the "ball" dream -- Side note of the United Equipment vs Continental Auto electronic basketball friendly match