During the interactive exchange session, the atmosphere was especially lively. Visitors actively asked questions regarding aspects like equipment accuracy, process compatibility, production capacity, after-sales support, and customized solutions. The technical team responded patiently with actual cases and test data, addressing industry concerns clearly. They particularly focused on comparisons between domestic and imported equipment, production line compatibility, and long-term reliability issues, enhancing customer confidence through data and practical experience.
After in-depth communications, many clients highly recognized Liande Semiconductor's technical strength and product implementation capabilities, expressing intentions for further cooperation, testing, validation, and production line integration. Some industry peers also engaged in deep discussions on advanced packaging trends and power device market demands, jointly exploring directions for industrial development.
From technology research and development to market implementation, from individual machine breakthroughs to integrated solution offerings, Liande Semiconductor builds upon its 28 years of R&D and manufacturing experience in high-end smart new display equipment under Liande Equipment. By comprehensively integrating and optimizing resources, it focuses on five core technologies: visual optics, artificial intelligence, precision machinery, software development, and electrical design. Particularly in the field of semiconductor testing and packaging equipment, it insists on innovation-driven product upgrades. This participation not only serves as a concentrated showcase of the company's technological achievements but also offers an important opportunity for face-to-face exchanges with industry partners and listening to market needs.
As the exhibition continues, Liande Semiconductor will continue to welcome every guest with professionalism and openness. In the future, the company will keep delving into core technologies, continuously optimizing product performance, providing more stable, efficient, and competitive packaging equipment solutions to help China's domestic semiconductor equipment steadily advance and co-create a new future with industry chain partners. (Reported by Liande Press)
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