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Semiconductor displays
Intelligent Cockpit System
Semiconductor Encapsulation&Test
New Energy
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Lamination
Bonding
Inspection
Film Attachment
M-LED
Flexible Production Line
Automative Display
Intelligent Cockpit Assembly
Die Bonder
Flip
Tape Attachment System
AOI Inspection
COF Technology
Electrode & Core Manufacturing
Cell Assembly Line
Module Pack Line
Photovoltaic Equipment
Other
Precision Dispensing
Small-sized
Small/Medium-sized
Medium/Large Sized
Medium/Small-Sized Bonding Line
Large/Ultra-large format Bonding Line
Small-Sized Bonding Line
VR/MR Bonding Line
COG/COF/FOG Indentation Inspection & Impedance Testing Machine
LCD Screen Defect Inspection Equipment
OTP/CTP Programming
OLED Curved-Surface Laminator
LCD/OLED Flat-Surface Attachment Machine
Curved-Surface Copper Foil Laminator
Sorter
Small and Medium Sized Mass Transfer Equipment
Large-Sized Mass Transfer Equipment
M-LED COF Bonding Line
LED Wafer Expander
Vacuum Film Pre-lamination Machine
High-Precision Splicing Equipment
Wafer Inspection
M-LED PCB Bonding Line
Smartphone Full-Line Assembly System
TP Assembly
Customizable Equipment
Bending Machine
Backlight Assembly Full Line
Automotive OCA/LOCA Lamination Full Line
Back Light Assembly Full Line
Automative Backlight Assembly Full Line
Automative Bonding Full Line
Cockpit Assembly/C axis
Eutectic Die Bonder
Soft Solder Die Bonder
COF Flip Chip Eutectic Bonder
QFN Lead Frame Pre-Tape Attachment Equipment
QFN Leadframe Post-Tape Attachment Equipment
QFN Leadframe Tape Attachment All-in-One Machine
Leadframe/Substrate AOI Auto-Inspection Equipment
Wafer Inspection
COF Thermal Patch Applicator
Die Cutting Machine
Cutting & Stacking Integrated Machine
High-Speed Stacking Machine
Prismatic Aluminum Shell Cell Assembly Line
Vacuum Drying Line
Filling Line
Blue Film Wrapping & Grading Line
Prismatic Li-Ion Cell Module Pack Line
Cylindrical Cell Module Pack Line
Photovoltaic Equipment
CCS Automatic Assembly Line
Precision Dispensing
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Research and Development Strength
Innovated Technology
Service Innovation
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Periodic Reports
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Home
About Liande
Discover Liande
Global Strategic Deployment
Social Responsibility
Contact Us
Product Solutions
Semiconductor displays
Lamination
Bonding
Inspection
Film Attachment
M-LED
Flexible Production Line
Intelligent Cockpit System
Automative Display
Intelligent Cockpit Assembly
Semiconductor Encapsulation&Test
Die Bonder
Flip
Tape Attachment System
AOI Inspection
COF Technology
New Energy
Electrode & Core Manufacturing
Cell Assembly Line
Module Pack Line
Photovoltaic Equipment
Other
Others
Precision Dispensing
Innovation Center
Research and Development Strength
Innovated Technology
Service Innovation
News and Events
Company News
Join Us
Recruitment Strategy
Career Development
Investor Relations
Company Notices
Periodic Reports
Investor Interaction
Investor Relations
CN
EN
Product Solution
Semiconductor Encapsulation&Test
Empowering the Industry Innovation and Advancing High-End Equipment Localization!
Semiconductor displays
Intelligent Cockpit System
Semiconductor Encapsulation&Test
New Energy
Others
01
Die Bonder
02
Flip
03
Tape Attachment System
04
AOI Inspection
05
COF Technology
Flip
COF Flip Chip Eutectic Bonder
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Latest News
High-Quality Development ׀ Liande Equipment Wins China's Outstanding Contribution Award in Advanced Display Industry
2024.09.12
Announcement of invitation to bid on the project of selecting and employing annual audit service institutions
2023.12.24
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