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Name
Eutectic Die Bonder
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Capacity
17K-18K
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Temperature Zone
8-zone with independent thermal control
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Accuracy
X-Y offset <±38μm
Die rotation <±3°
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Wafer System
8" wafer, compatible with 6"
Rotation : 360° (MAX)
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Material Handling
Loading Mode：Reel to reel
Unloading Mode：Punch-cut magazine
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Die Bonding Force
30-500g
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Equipment Dimensions
L760×W610×H1300mm
Eutectic Die Bonder
The eutectic die bonder heats different packaging materials in contact with semiconductor chips to form eutectic points through cooling and solidification, designed for packaging SOT, SOD, and other semiconductor discrete devices with high-spec linear motor drive, independently controlled cutting system, and high-speed/high-precision/high-stability characteristics.
Details
Technical Specification
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