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Name
Soft Solder Die Bonder
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Accuracy
X-Y offset <±40μm, rotation <±2°
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Temperature Zone
8 zones; controlling independently
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Capacity
4-9K (diverse models; efficiency varies by model)
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Pneumatic system
10-channel pneumatic system
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Wafer System
12" wafer, compatible with 8"/6" (optional)
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Void rate
Single<2%, total<5%
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Solder dot thickness
25-75μm
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Flatness
<30μm
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Material Handling
Loading Mode: Multi-mode selectable, such as : Vertical stack suction/Magazine loading/Flip-chip suction
Unloading Mode: Magazine Unloading
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Die Bonding System
Die Bonding Force: 30-500g
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Rotation
360° (MAX)
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Equipment Dimensions
L2300mm (2560mm with pusher) ×W1380×H1420mm
Soft Solder Die Bonder
The soft solder die bonder is a packaging equipment that mounts chips onto corresponding packaging materials using tin-based soldering heating method, specifically designed for die bonding processes in power devices including TO-220, TO-427, 3P, TO-252, and PPAK .etc packages.
Details
Technical Specification
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