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Name
Integrated Mini-LED Die Bonder
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Capacity
UPH with Single Head: 270K (@P0.9mm)
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Die Bonding Accuracy
<3 degree
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Supported Die Specifications
≥P0.3mm (Monochrome arrangement)
UV film compatibility: 110×110mm square film
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Substrate Size
Max. 400×300mm
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Material Handling
UV film & glass cassette loading/unloading
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Dimensions
L1600×W2100×H2300mm (For reference only)
Integrated Mini-LED die bonder
The integrated Mini-LED die bonder enables achieving simultaneously die bonding of three Mini-LED chips on single substrate.
Details
Technical Specification
Equipment characteristic
- Application in display industry, PCB-type carrier;
- Chip auto-alignment software enabling three different chip types on a single substrate;
- Bonding head with full-loop controlled servo motor, equiped with missing die inspection;
- Chip stage with linear motor-driven XY alignment and angular compensation alignment;
- Wafer ring cassette system with automatic ring changing.
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