-
Name
QFN Leadframe Post-Tape Attachment Equipment
-
Key features
Optional pre-heating module for special film;
Optional AOI accuracy inspection module for post-attachment;
Monitoring attachment quality in real-time.
-
Attachment Accuracy
±0.3mm
-
Platform Temperature
Max. 160℃
-
Leadframe Dimensions
150-300mm(L), 60–100mm(W), 0.1–0.5mm(H) (For reference only)
-
Capacity
UPH≥ 160 (Depends on constant temperature time )
-
Technological Process
Auto-loading → Cleaning → Tape Attachment → Auto-unloading
QFN Leadframe Post-Tape Attachment Equipment
The QFN Leadframe Post-Tape Attachment Equipment executes cassette-based automated material handling for semiconductor QFN/DFN packaging post-tape processes, performing automatically adhesive tape application on product surfaces with constant-temperature chamber thermal activation, optionally configurable with AOI inspection modules for automatic tape application accuracy detection.
Details
Technical Specification
Related Products
Are you looking for the right solution for your industry?
If you are looking for best solution to improve your productivity, please contact us, and we will be happy to assist you
