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Name
QFN Leadframe Pre-Tape Attachment All-In-One Equipment
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Key features
For specialized films, the film application roller can be optionally equipped with a heating function.
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Attachment Accuracy
±0.3mm
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Platform Temperature
Max. 160℃
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Leadframe Dimensions
150–300mm(L), 60–100mm(W), 0.1–0.5mm(H) (For reference only)
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Capacity UPH
Front Side：240
Back Side：150
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Technological Process
Auto-loading → Cleaning → Tape Attachment → Auto-unloading
QFN Leadframe Pre-Tape Attachment All-In-One Equipment
QFN Leadframe Pre-Tape Attachment All-In-One Equipment handles automated material handling for semiconductor QFN/DFN pre-tape and post-tape processes with dual-tape platform design, executes automatically adhesive tape application on product surfaces, supports both stacked and magazine-style material handling modes, and achieves compatibility with integrated pre/post-die-attach tape processes (pre-wire-bonding & post-wire-bonding tape attachment) through dedicated fixture designs.
Details
Technical Specification
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