2025年3月26日，全球规模最大的半导体年度盛会SEMICON China在上海新国际博览中心盛大开幕。超千家展商汇聚，共同探索“芯”趋势与“芯”机遇。
Liande Semiconductor showcased two innovative devices at Booth 7143 in Hall E7 of the SEMICON China 2025 exhibition: the COF (Chip on Film) flip-chip bonding machine and the soft soldering die bonder. The company also received two prestigious awards, further cementing its status as a focal exhibitor in the semiconductor packaging equipment sector.
The director provided on-site explanations, while engineers performed real-time operations. Attendees were able to observe the bonding solder points through high-definition microscopes, experiencing firsthand the awe of "micron-level precision."
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