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COF Flip-Chip Eutectic Machine

The COF flip-chip eutectic machine is a high-precision flip-chip bonding device specifically designed for achieving fine-pitch, high-density interconnections between display driver chip bumps and flexible substrate leads. This high-speed, high-precision chip bonding equipment utilizes flip-chip and eutectic thermocompression welding processes to bond fine-pitch, high-density chip bumps with inner lead bonding (ILB). The machine achieves a chip bonding precision of 1.5 μm and includes post-bond precision and defect detection functionalities.

This equipment is the first domestically developed high-precision flip-chip bonding machine for display driver chips in China, fully independently researched and developed. It is widely used in advanced semiconductor packaging fields such as LCD/OLED display driver chips, serving as a critical packaging device in these areas.

Soft Solder Die Bonder

The soft solder die bonder utilizes soft soldering processes (soft solder) to mount semiconductor IC chips onto the corresponding lead frame pads with high speed and high precision. Specifically developed for 12-inch wafers, composite feeding, post-bond inspection, and other functional requirements, this equipment features high precision and high stability. The chip bonding device is widely applicable to semiconductor power device packaging and testing companies, including TO-220, TO-247, TO-252, TO-263, photovoltaic devices, and more.

High-Speed Eutectic Die Bonder

The high-speed eutectic die bonder is a high-speed chip bonding device that uses high-temperature eutectic welding to precisely mount chips onto the corresponding lead frame pads. The machine features independent PLC control for the punching mechanism and employs customized high-speed, high-precision linear motor drives for the bonding head module. This equipment is characterized by its high speed and high stability, making it widely applicable for chip attachment processes in semiconductor discrete devices such as SOT (Small Outline Transistor) and SOD (Small Outline Diode).

QFN Lead Frame Tape Laminator

The QFN lead frame tape laminator is a fully automated device specifically designed for the backside taping process of QFN (Quad Flat No-leads) and DFN (Dual Flat No-leads) lead frames. This equipment uses a roll lamination process and is compatible with both pre-taping (used before die bonding, DB) and post-taping (used after wire bonding, WB). It automatically handles the loading and unloading of lead frame products and features dual taping platforms for precise application of adhesive tapes to the backside of QFN/DFN lead frames. The machine can meet the requirements of stacked and magazine-style material handling. Characterized by high speed, high precision, and high stability, this equipment is widely used in semiconductor QFN/DFN packaging and testing production lines to complete the lead frame taping process, preventing overflow during the molding process.

Liande Semiconductor has always been dedicated to the research and innovation of semiconductor equipment. Its development foundation comes from 27 years of technical accumulation by "Liande Equipment" in the field of high-end intelligent new display equipment, as well as a profound understanding of market demands. Relying on this deep accumulation, Liande Semiconductor's products have established a reputation for stable performance and technical advantages within the industry. The series of equipment showcased at the exhibition not only represent the company's current technological capabilities but also embody forward-looking explorations and practical breakthroughs in future semiconductor packaging technology trends.

Liande Semiconductor focuses on back-end semiconductor packaging and testing equipment and has independently developed multiple semiconductor devices, including high-precision flip-chip bonding machines, high-speed RFID chip bonding equipment, high-speed eutectic die bonders, soft solder die bonders, MiniLED mass transfer equipment, lead frame tape laminators, COF heat dissipation taping equipment, and more. Currently, major customers include Tongfu Microelectronics, Huatian Technology, Nexperia Semiconductor, AOS, Xinhenghui Electronics, and other well-known domestic and international semiconductor packaging and testing companies.

As the exhibition is about to begin, Liande Semiconductor sincerely invites industry experts, scholars, corporate representatives, and semiconductor enthusiasts to visit our booth. Join us to discuss new technologies and plan for future development together. We firmly believe that with the exhibition as a bridge, the technical exchanges between Liande Semiconductor and industry colleagues will become increasingly in-depth, and the scope for cooperation will continue to expand. Let us look forward to the arrival of September 10th and collectively experience the vibrant pulse of innovation and development in the semiconductor industry at this grand event! Liande Semiconductor warmly welcomes your visit!