- Name
Fully automated Medium-sized 5-17.3'' Bonding Full Line LD/EC/COG/FOG/AOI/FOB/FOB AOI Bonding Full Line
- Product Size
5-17.3Inch
- Takt Time
10s (Single-side mounted quad FPC connectors)
- Equipment Accuracy
ACF Bonding Accuracy: X: ±0.15mm(3σ), Y: ±0.1mm(3σ)
Water contact angle: <15°
COG: XY: ±5μm(3σ)
FOG: XY: ±10μm(3σ)
PCB: X: ±25μm(3σ), Y: ±30μm(3σ)
- Equipment dimensions
L33900×W3000×H2200mm (For reference only)
- Technical Avantages
Fully automated in-line loading/unloading;
Automated stringing operation;
Automatic IC stacking and loading;
Automatic flipping function for multi-side/multi-IC handling;
FPC bonding section supports maximum 4 types of loading and bonding;
PCB auto-loading with cleaning;
Expandable to multi-PCB bonding; Post-bonding 3D camera inspection for indentation/foreign object detection etc;
Full-line support digital material ledger functionalities, such as MES/CIM. etc integration.
- Technological Process
LD → EC → IC Bonding → FPC Bonding → AOI+ART → PCB Bonding → PCB AOI → ULD
Fully automated Medium-sized 5-17.3'' Bonding Full Line LD/EC/COG/FOG/AOI/FOB/FOB AOI Bonding Full Line
Fully automated Medium-sized Bonding Full Line for screens under 17.3'' of notebook/automotive products, featuring:
- Auto-loading
- Bonding zone plasma cleaning
- IC auto-loading →automatic vision-aligned bonding
- FPC auto-loading → cleaning → auto-bonding
- Post-bonding AOI offset & ART impedance testing
- PCB auto-loading → bonding → secondary ART verification
- Triple-function dispensing
- Auto-unloading by material handling machine interfacing with dual-layer AGV material carrier/overhead conveyor
技术参数
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